Microfocus X-ray Inspection Systems and SEM equipment sales & support.
Low Cost Refurbished X-ray Inspection & Electron Microscopy Equipment. SMT PCB, BGA, QFP and Semiconductor Failure Analysis.
Low Cost Refurbished X-ray Inspection & Electron Microscopy Equipment. SMT PCB, BGA, QFP and Semiconductor Failure Analysis.
The FXS 100.24 is great for general Microfocus X-ray inspection applications including:
Multilayer SMT card with 0.5mm BGA. Solder balls are 300 micron diameter.
Six layer SMT card with 0.5mm pitch BGA devices. 25um Au bond wires.
8 X 12 inch PCB in tilt / Rotate chuck.
The Feinfocus FXS 100.24 is suitable for microchip package Failure Analysis.
Lead frame showing bond wire heels inside an epoxy encapsulated QFP device.
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Located in Gilbert, Arizona with Industrial Facility in Mesa, Arizona.
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